WSPS

PAD-Fume
Programmable Automatic Decomposition Fumer

The PAD-Fume is a chemical reaction chamber, which allows etching of wafers with HF from vapor phase. The material in contact with HF vapor is optimized for ultimate cleanliness. The system is designed for safe handling of HF vapor and can be operated without chemical hood.

PAD-Scan
Programmable Automatic Droplet Scanner

The PAD-Scan allows collection of the dissolved residue with a liquid droplet. It features various scanning patterns, advanced handling of droplets and sophisticated preparation for subsequent analysis.

PAD-Dry
Programmable Automatic Droplet Dryer

The PAD-Dry prepares the droplet for TXRF analysis by drying on the wafer. It uses vacuum and moderate heat for a smooth and fast drying.

As a production oriented tool the WSPS offers all options for automatic wafer handling including SMIF and FOUP loadports. All software standards like SECS/GEM are implemented for integration into the fab control system.

The wafer is first processed with the PAD-Fume for dissolution of the oxide layer by gaseous HF/H₂O (vapor phase decomposition). Subsequently the now hydrophobic wafer is scanned with the PAD-Scan for collecting the dissolved oxide residue.

The droplet is transferred to a vial for analysis by AAS or ICP-MS. For TXRF analysis the droplet remains on the scanned wafer or is deposited on a reference wafer. The wafer with the droplet(s) is processed with the PAD-Dry in order to produce small, solid residue in a TXRF compatible shape.